? semiconductor components industries, llc, 2014 september, 2014 ? rev. 4 1 publication order number: nl17sgu04/d nl17sgu04 unbuffered inverter the nl17sgu04 minigate is an advanced high?speed cmos unbuffered inverter in ultra?small footprint. the nl17sgu04 input structures provides protection when voltages up to 4.6 v are applied. features ? wide operating v cc range: 0.9 v to 3.6 v ? high speed: t pd = 1.9 ns (typ) at v cc = 3.0 v, c l = 15 pf ? low power dissipation: i cc = 0.5 a (max) at t a = 25 c ? 4.6 v overvoltage tolerant (ovt) input pins ? ultra?small packages ? nlv prefix for automotive and other applications requiring unique site and control change requirements; aec?q100 qualified and ppap capable ? these devices are pb?free, halogen free/bfr free and are rohs compliant v cc nc in a out y gnd 1 2 34 5 figure 1. sot?953 (top thru view) v cc nc in a gnd figure 2. sc?88a (top view) 1 2 3 5 4 figure 3. udfn (top view) 1 2 3 6 5 4 nc in a gnd nc v cc out y out y figure 4. logic symbol 1 in a out y http://onsemi.com ordering information see detailed ordering and shipping information on page 5 o f this data sheet. marking diagrams sot?953 case 527ae 4 m 1 l h a input y output h l function table udfn6 1.0 x 1.0 case 517bx m udfn6 1.45 x 1.0 case 517aq m sc?88a df suffix case 419a ay m m q 3 pin assignment 1 2 3nc in a gnd 4 5v cc out y 6 sot?953 sc?88a udfn6 nc in a gnd v cc out y gnd nc in a v cc out y gnd nc in a nc out y v cc m = date code* = pb?free package (note: microdot may be in either location) *date code orientation and/or position may vary depending upon manufacturing location.
nl17sgu04 http://onsemi.com 2 maximum ratings symbol parameter value unit v cc dc supply voltage ?0.5 to +5.5 v v in dc input voltage ?0.5 to +4.6 v v out dc output voltage output at high or low state power?down mode (v cc = 0 v) ?0.5 to v cc +0.5 ?0.5 to +4.6 v i ik dc input diode current v in < gnd ?20 ma i ok dc output diode current v out < gnd ?20 ma i out dc output source/sink current 20 ma i cc dc supply current per supply pin 20 ma i gnd dc ground current per ground pin 20 ma t stg storage temperature range ?65 to +150 c t l lead temperature, 1 mm from case for 10 seconds 260 c t j junction temperature under bias +150 c msl moisture sensitivity level 1 f r flammability rating oxygen index: 28 to 34 ul 94 v?0 @ 0.125 in v esd esd withstand voltage human body model (note 2) machine model (note 3) >2000 >150 v i latchup latchup performance above v cc and below gnd at 125 c (note 4) 100 ma stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. 1. measured with minimum pad spacing on an fr4 board, using 10 mm?by?1 inch, 2?ounce copper trace with no air flow. 2. tested to eia/jesd22?a114?a. 3. tested to eia/jesd22?a115?a. 4. tested to eia/jesd78. recommended operating conditions symbol characteristics min max unit v cc positive dc supply voltage 0.9 3.6 v v in digital input voltage 0.0 3.6 v v out output voltage output at high or low state power?down mode (v cc = 0 v) 0.0 0.0 v cc 3.6 v t a operating temperature range ?55 +125 c t / v input transition rise or fail rate v cc = 3.3 v 0.3 v 0 10 ns/v functional operation above the stresses listed in the recommended operating ranges is not implied. extended exposure to stresse s beyond the recommended operating ranges limits may affect device reliability.
nl17sgu04 http://onsemi.com 3 dc electrical characteristics symbol parameter conditions v cc (v) t a = 25 c t a = -55 c to +125 c min max min max unit v ih high-level input voltage 0.9 v cc v cc v 1.1 to 1.3 0.7xv cc 0.7xv cc 1.4 to 1.6 0.65xv cc 0.65xv cc 1.65 to 1.95 0.65xv cc 0.65xv cc 2.3 to 2.7 1.7 1.7 3.0 to 3.6 2.0 2.0 v il low-level input voltage 0.9 gnd gnd v 1.1 to 1.3 0.3xv cc 0.3xv cc 1.4 to 1.6 0.35xv cc 0.35xv cc 1.65 to 1.95 0.35xv cc 0.35xv cc 2.3 to 2.7 0.7 0.7 3.0 to 3.6 0.8 0.8 v oh high-level output voltage v in = v ih or v il i oh = ?20 a 0.9 0.75 0.75 v i oh = -0.3 ma 1.1 to 1.3 0.75xv cc 0.75xv cc i oh = -1.7 ma 1.4 to 1.6 0.75xv cc 0.75xv cc i oh = -3.0 ma 1.65 to 1.95 vcc-0.45 vcc-0.45 i oh = -4.0 ma 2.3 to 2.7 2.0 2.0 i oh = -8.0 ma 3.0 to 3.6 2.48 2.48 v ol low-level output voltage v in = v ih or v il i ol = 20 a 0.9 0.1 0.1 v i ol = 0.3 ma 1.1 to 1.3 0.25xv cc 0.25xv cc i ol = 1.7 ma 1.4 to 1.6 0.25xv cc 0.25xv cc i ol = 3.0 ma 1.65 to 1.95 0.45 0.45 i ol = 4.0 ma 2.3 to 2.7 0.4 0.4 i ol = 8.0 ma 3.0 to 3.6 0.4 0.4 i in input leakage current 0 v in 3.6 v 0 to 3.6 0.1 1.0 a i cc quiescent supply current v in = v cc or gnd 3.6 0.5 10.0 a product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions.
nl17sgu04 http://onsemi.com 4 ????????????????????????????????? ????????????????????????????????? input t r = t f = 3.0 ns symbol parameter test condition v cc (v) t a = 25 c t a = -55 c to +125 c min typ max min max unit t plh , t phl propagation delay, a to y c l = 10 pf, r l = 1 m 0.9 - 8.0 10.3 - 13.3 ns 1.1 to 1.3 - 6.0 9.4 - 12.2 1.4 to 1.6 - 3.2 8.5 - 10.0 1.65 to 1.95 - 2.6 6.2 - 6.7 2.3 to 2.7 - 2.0 3.9 - 4.4 3.0 to 3.6 - 1.7 3.1 - 3.7 c l = 15 pf, r l = 1 m 0.9 - 19.5 11.7 - 14.5 ns 1.1 to 1.3 - 7.0 9.2 - 12.2 1.4 to 1.6 - 3.5 6.3 - 10.2 1.65 to 1.95 - 3.0 5.9 - 7.1 2.3 to 2.7 - 2.3 4.4 - 5.0 3.0 to 3.6 - 1.9 3.4 - 3.9 c l = 30 pf, r l = 1 m 0.9 - 10.0 12.5 - 15.6 ns 1.1 to 1.3 - 9.0 11.6 - 13.8 1.4 to 1.6 - 6.0 9.1 - 12.9 1.65 to 1.95 - 4.5 8.2 - 9.6 2.3 to 2.7 - 3.2 5.7 - 6.1 3.0 to 3.6 - 2.5 4.4 - 4.8 c in input capacitance 0 to 3.6 3 - - - pf c o output capacitance v o = gnd 0 3 - - - pf c pd power dissipation capacitance (note 5) f = 10 mhz 0.9 to 3.6 - 4 - - - pf product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 5. c pd is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption with out load. average operating current can be obtained by the equation: i cc(opr ) = c pd v cc f in + i cc . c pd is used to determine the no?load dynamic power consumption; p d = c pd v cc 2 f in + i cc v cc .
nl17sgu04 http://onsemi.com 5 figure 5. switching waveforms figure 6. test circuit gnd 50% 50% v cc a or b y t phl t plh 50% v cc input c l * *includes all probe and jig capacitances a 1?mhz square input wave is recommended for propagation delay tests. output ordering information device package shipping ? nl17sgu04p5t5g sot?953 (pb?free) 8000 / tape & reel nl17sgu04dft2g sc?88a (pb?free) 3000 / tape & reel nlv17sgu04dft2g* sc?88a (pb?free) 3000 / tape & reel NL17SGU04AMUTCG (in development) udfn6 1.45x1 mm (pb?free) 3000 / tape & reel nl17sgu04cmutcg (in development) udfn6 1x1 mm (pb?free) 3000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. *nlv prefix for automotive and other applications requiring unique site and control change requirements; aec?q100 qualified and ppap capable.
nl17sgu04 http://onsemi.com 6 package dimensions sot?953 case 527ae issue e *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* e d c a h e 123 4 5 notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters 3. maximum lead thickness includes lead finish. minimum lead thickness is the minimum thickness of the base material. 4. dimensions d and e do not include mold flash, protrusions, or gate burrs. dim min nom max millimeters a 0.34 0.37 0.40 b 0.10 0.15 0.20 c 0.07 0.12 0.17 d 0.95 1.00 1.05 e 0.75 0.80 0.85 e 0.35 bsc l 0.95 1.00 1.05 h e x y pin one indicator b 5x x 0.08 y l 5x l3 l2 e 5x 5x l2 0.05 0.10 0.15 l3 ??? ??? 0.15 0.175 ref top view side view bottom view 1.20 dimensions: millimeters 0.20 5x 1 package outline 0.35 pitch 0.35 5x
nl17sgu04 http://onsemi.com 7 package dimensions udfn6 1.0x1.0, 0.35p case 517bx issue o soldering footprint* recommended dim min max millimeters a 0.45 0.55 a1 0.00 0.05 a3 0.13 ref b 0.12 0.22 d 1.00 bsc e 1.00 bsc e 0.35 bsc l 0.25 0.35 l1 0.30 0.40 a b e d 0.10 c pin one reference top view 0.10 c a a1 0.05 c 0.05 c c seating plane side view 2x 2x a3 bottom view b e 6x 0.10 b 0.05 a c c l 5x note 3 l1 1 3 4 6 m m dimensions: millimeters 0.22 5x 0.48 6x 1.18 0.53 pitch 0.35 1 pkg outline
nl17sgu04 http://onsemi.com 8 package dimensions udfn6 1.45x1.0, 0.5p case 517aq issue o notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip. a b e d bottom view b e 6x 0.10 b 0.05 a c c l 6x note 3 0.10 c pin one reference top view 0.10 c 6x a a1 0.05 c 0.05 c c seating plane side view 1 3 4 6 dim min max millimeters a 0.45 0.55 a1 0.00 0.05 b 0.20 0.30 d 1.45 bsc e 1.00 bsc e 0.50 bsc l 0.30 0.40 l1 ??? 0.15 dimensions: millimeters 0.30 6x 1.24 0.53 pitch *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 0.50 1 mounting footprint package outline l1 detail a l optional constructions l 0.07 ref 6x a2 detail b detail a
nl17sgu04 http://onsemi.com 9 package dimensions notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. 419a?01 obsolete. new standard 419a?02. 4. dimensions a and b do not include mold flash, protrusions, or gate burrs. dim a min max min max millimeters 1.80 2.20 0.071 0.087 inches b 1.15 1.35 0.045 0.053 c 0.80 1.10 0.031 0.043 d 0.10 0.30 0.004 0.012 g 0.65 bsc 0.026 bsc h --- 0.10 --- 0.004 j 0.10 0.25 0.004 0.010 k 0.10 0.30 0.004 0.012 n 0.20 ref 0.008 ref s 2.00 2.20 0.079 0.087 b 0.2 (0.008) mm 12 3 4 5 a g s d 5 pl h c n j k ?b? sc?88a (sc?70?5/sot?353) case 419a?02 issue l mm inches scale 20:1 0.65 0.025 0.65 0.025 0.50 0.0197 0.40 0.0157 1.9 0.0748 solder footprint* *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other inte llectual property. a listing of scillc?s pr oduct/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent?marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typical s? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 nl17sgu04/d minigate is a trademark of semiconductor components industries, llc (scillc). literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative
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